Description: Machine Type: wafer machine, pick and place machine, die bonder machine warranty: 3 Months machinery test report: Not Available video outgoing-inspection: Not Available brand name: Leader Range Hitech place of origin: Malaysia weight (kg): 0.001 Material: Carbide (HRC 85) Packaging: 5pc/Bottle Logistic Mode: Air Freight Condition: New Showroom Location: Malaysia Applicable Industries: Semicon Die Bond Wire Bond Machine Tape,Reel Machine Marketing Type: Machine Part Core Components: Single component product Selling Units: Single item Price: 50.80 / pieces Location: malaysia